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LP Low Profile ED Copper Foil For Phenolic / Epoxy Board 99.8% Purity

JIMA Copper
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LP Low Profile ED Copper Foil For Phenolic / Epoxy Board 99.8% Purity

Brand Name : JIMA
Model Number : EDCULP
Certification : SGS, ISO,Reach, RoHS
Place of Origin : china
MOQ : 100kg
Price : usd 15-20 kg
Supply Ability : 1000 Ton per month
Delivery Time : 5-15 days
Packaging Details : wooden carton
Purity : 99.8%
pinholes : None
Anti oxidation : 200 degree 60 minutes, 180 days 23 degree
Thickness : 1/2 oz,3/4 oz,1 oz,2 oz,3 oz,
Color : red or black
Elongation : ≥ 5%
tensile strength : ≥ 180 MPa
peel strength : ≥ 1 N/mm
foil profile : RA≤2.5μm,Rz≤4.0μm
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LP-S-B/R low profile electrodeposited ED electrolytic copper foil for FPC fccl

matte side treatment low profile foil in back/red.

Features:

1. the treated foil in gray or red

2. High profile with properties of LP-S-B/R suitable for FCCL

3. Grain structure of copper foil leads to high flexibility

4. Excellent etching performance

5. low profile enables to make fine circuit pattern

Application:

1. Casting and lamination type FCCL

2. Super fine pattern FPC

3. Chip on flex (COF) for LED


Typical properties of LP-S-B/R ED electrolytic copper foil(for FPC or inner layer of HDI)

Classification


UnitRequirementTest Method
Foil Designation/1HM1IPC-4562A
Nominal thickness/10um12um1/2 OZ(18um)3/4 OZ(25um)1 OZ(35um)IPC-4562A
Area Weightg/㎡98±4107±4153±5228±8285±10

IPC-TM-650

2.2.12.2

Purity≥99.8

IPC-TM-650

2.3.15

Foil ProfileShiny side(Ra)սm≤2.5≤2.5≤2.5≤2.5≤2.5

IPC-TM-650

2.3.17

Matte side(Rz)um≤4.0≤4.5≤5.5≤6.0≤8.0
Tensile StrengthR.T.(23℃)Mpa≥260≥260≥280≥280≥280

IPC-TM-650

2.3.18

H.T.(180℃)Mpa≥180≥180≥180≥180≥180
ElongationR.T.(23℃)≥5≥6≥8≥10≥12

IPC-TM-650

2.3.18

H.T.(180℃)≥5≥6≥7≥8≥8
Peel Strength(FR-4)N/mm0.70.81.01.11.2

IPC-TM-650

2.4.8

Ibs/in44.65.76.36.9
Pinholes&porosityNumberNo

IPC-TM-650

2.1.2

Anti-oxidizationR.T.(23℃)180days/
H.T.(200℃)60 Minutes/

1.Standard Width 520mm,max width 1295(±1)mm,May according to the customer request tailor.

We test the peel strength with PI ,please reconfirm with your pp.


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LP Low Profile ED Copper Foil For Phenolic / Epoxy Board 99.8% Purity Images

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